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Channel Mobility Boosting in a Poly-Si Channel Using Ge Diffusion Engineering and Hydrogen Plasma Treatment
Journal
IEEE Electron Device Letters
Author
Tae In Lee, Min Ju Kim, Eui Joong Shin, Gyusoup Lee, Jaejoong Jeong, Yun Hee Lee, Jung Hoon Lee, Jaeduk Lee, and Byung Jin Cho
Year
2022
Date
Jan.2022
File
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Channel Mobility Boosting in a Poly-Si Channel Using Ge Diffusion Engineering and Hydrogen Plasma Treatment" has been accepted to IEEE EDL.