Selective Pore-Sealing of Highly Porous Ultralow-k dielectrics for ULSI Interconnects by Cyclic Initiated Chemical Vapor Deposition Process
- Journal
- 2018 Symposium on VLSI Technology
- Year
- 2018
- File
- 921cb5d0fd18603339629033ea4a9cc5.png (1.2M) 3회 다운로드 DATE : 2020-12-02 13:50:24
