Elimination of slips on silicon wafer edge in rapid thermal process by using a ring oxide
- Journal
- J. Appl. Phys.
- Year
- 1990
B. J. Cho and C. K. Kim, "Elimination of slips on silicon wafer edge in rapid thermal process by using a ring oxide", J. Appl. Phys., vol. 67, no. 12, pp. 7583-7586, Jun. 1990.