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Total 9건 1 페이지

2023
9

"Application of Pulsed Green Laser Activation to Top-tier MOSFET Fabrication for Monolithic 3D Integration" Youngkeun Park, Jaejoong Jeong, Semin Noh, Heetae Kim, Seongho Kim, Kiryong Kim, Dongbin Kim, Min Ju Kim and *Byung Jin Cho, (Senior Member, IEEE), IEEE Transactions on Electron Devices, 71, 890-895, 08 December 2023.

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8

"Sn-doped n-type amorphous gallium oxide semiconductor with energy bandgap of 4.9 eV" Dahee Seo, Jongsu Baek, Sunjae Kim, Byung Jin Cho, Wan Sik Hwang, Materials Science in Semiconductor Processing, 169, October 2023.
7

"Physical Reservoir based on a Leaky-FeFET Using the Temporal Memory Effect" Gyusoup Lee, Changyeon Kang, Seongho Kim, Youngkeun Park, Eui Joong Shin, and *Byung Jin Cho (Senior Member, IEEE), IEEE Electron Device Letters (EDL), 28 November 2023.

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6

"Heterogeneous 3-D Sequential CFET with Ge (110) Nanosheet p-FETs on Si (100) bulk n-FETs" Seong Kwang Kim, Hyeong-Rak Lim, Jaejoong Jeong, Seung Woo Lee, Juhyuk Park, Joon Pyo Kim, Jaeyong Jeong, Bong Ho Kim, Seung-Yeop Ahn, Youngkeun Park, Dae-Myoung Geum, Younghyun Kim, Yongku Baek, Byung Jin Cho , Sanghyeon Kim, IEEE Transactions on Electron Devices, 21 November 2023.

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5

"A Non-Invasive Approach to the Resistive Switching Physical Model of Ultra-Thin Organic-Inorganic Dielectric-based ReRAM" Alba Martinez, Byung Jin Cho, Min Ju Kim, Nanoscale, 01 November 2023.

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4

"The Effect of Alkyl Chain Length in Organic Semiconductors and Surface Polarity of Polymer Dielectrics in Organic Thin-Film Transistors (OTFTs)" Junhwan Choi, Min Ju Kim, Joo-Young Kim, Eun Kyung Lee, Changhyeon Lee, Youngkeun Park, Juyeon Kang, Jeong-Il Park, Byung Jin Cho and Sung Gap Im, Small methods, 01 August 2023.
3

"Dual-Mechanism Memory Combining Charge Trapping and Polarization Switching for Wide Memory Window Flash Cell" Eui Joong Shin, Gyusoup Lee, Seongho Kim, Jun Hong Chu and Byung Jin Cho, IEEE Electron Device Letters (EDL), 44 (Issue : 7), 1108 - 1111, 05 June 2023.
2

"A Novel Structured Single Device Neuron for Low Standby Power and Compact System Application" Gyusoup Lee, Jungyeop Oh, Eui Joong Shin, Seongho Kim, Youngkeun Park, Min Ju Kim, Sung-Yool Choi, Byung Jin Cho, IEEE Electron Device Letters (EDL), 44, 528-531, 03 February 2023.

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1

"Ultralow-k Amorphous Boron Nitride Film for Copper Interconnect Capping Layer" Kiryong Kim, Hyeongjoon Kim, Sun-Woo Lee, Min Yung Lee, Gyusoup Lee, Youngkeun Park, Heetae Kim, Yun Hee Lee, Minsu Kim, Kyung Yeol Ma, Min Ju Kim, Taek-Soo Kim, Hyeon Suk Shin, and Byung Jin Cho, IEEE Transactions on Electron Devices (TED) , vol. 70, no. 5, pp. 2588-2593, .

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