A novel approach for integration of dual metal gate process using ultra thin aluminum nitride buffer layer
- Year
- 2003
- Author
- C. S. Park, B. J. Cho, N. Balasubramanian, and D. L. Kwong
- Conference
- 2003 Symposium on VLSI Technology, Digest of Technical Papers
C. S. Park, B. J. Cho, N. Balasubramanian, and D. L. Kwong, "A novel approach for integration of dual metal gate process using ultra thin aluminum nitride buffer layer", 2003 Symposium on VLSI Technology, Digest of Technical Papers, pp. 149, Kyoto, Japan 2003.
Japan 2003.
Kyoto