The Process Development for Monolithic 3D Integration Using Large-Scale Silicon-On-Insulator(SOI) Wafer Bonding
- Year
- 2022
- Author
- Hyeon Cheol Cho
- Co-author
- Hoon Hee Han, Jaejoong Jeong, Byung Jin Cho, and Changhwan Choi
- Conference
- The 29th Korean Conference on Semiconductors
Hyeon Cheol Cho, Hoon Hee Han, Jaejoong Jeong, Byung Jin Cho, and Changhwan Choi, "The Process Development for Monolithic 3D Integration Using Large-Scale Silicon-On-Insulator(SOI) Wafer Bonding", The 29th Korean Conference on Semiconductors, Kangwondo, Korea, January 24-26. 2022.