Monolithic 3D 집적 공정에서의 ILD 두께에 따른 열 분포 분석
- Year
- 2023
- Author
- Jaejoong Jeong
- Co-author
- Youngkeun Park, Yongku Baek, Heetae Kim, Dong Bin Kim, and Byung Jin Cho
- Conference
- The 30th Korean Conference on Semiconductors
Monolithic 3D 집적 공정에서의 ILD 두께에 따른 열 분포 분석
Jaejoong Jeong, Youngkeun Park, Yongku Baek, Heetae Kim, Dong Bin Kim, and Byung Jin Cho
School of Electrical Engineering, KAIST