Conference

  • Home
  • Publication
  • Conference
Mechanical and Electrical Reliability of NMP Optimized Flexible Si CMOS IC 
Year
2018 
Author
Seung-Yoon Kim, Cheolgyu Kim, Jae Hoon Bong, Wan Sik Hwang, Taek-Soo Kim, Jae Sub Oh and Byung Jin Cho 
Conference
The 25th Korean Conference on Semiconductors 

Seung-Yoon Kim, Cheolgyu Kim, Jae Hoon Bong, Wan Sik Hwang, Taek-Soo Kim, Jae Sub Oh and Byung Jin Cho, “Mechanical and Electrical Reliability of NMP Optimized Flexible Si CMOS IC ”, The 25th Korean Conference on Semiconductors, Kangwondo, Korea, Feb. 5-7, 2018.


Feb. 5-7, 2018.
Kangwondo, Korea