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Improved Electromigration-Resistance of Cu Interconnects by Graphene-Based Capping Layer 
Year
2015 
Author
Seong Jun Yoon, Alexander Yoon, Wan Sik Hwang, Sung-Yool Choi, and Byung Jin Cho 
Conference
2015 Symposium on VLSI Technology 
File
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Seong Jun Yoon, Alexander Yoon, Wan Sik Hwang, Sung-Yool Choi, and Byung Jin Cho, "Improved Electromigration-Resistance of Cu Interconnects by Graphene-Based Capping Layer", 2015 Symposium on VLSI Technology, Kyoto, Japan, June 15-19, 2015.
June 15-19, 2015.
Kyoto, Japan