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Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits 
Year
2020 
Author
Hoonhee Han, Rino Choi, Seong-Ook Jung, Sung Woo Chung, Byung Jin Cho, S. C. Song, and Changhwan Choi 
Conference
IEEE International Electron Devices Meeting (IEDM) 

Hoonhee Han, Rino Choi, Seong-Ook Jung, Sung Woo Chung, Byung Jin Cho, S. C. Song, and Changhwan Choi, "Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits," IEEE International Electron Devices Meeting, December 12-18, 2020.