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Total 5건 1 페이지

2022
5

"Channel Mobility Boosting through Ge profile and grain size engineering in a Ge-diffused Poly-Si channel for 3D V-NAND Flash Memory" Tae In Lee, Yun Hee Lee, Eui Joong Shin, Min Ju Kim, Jung Hoon Lee, Jaeduk Lee, and Byung Jin Cho, The 29th Korean Conference on Semiconductors, 2022
4

"Electric-field-cycling-induced phase transformation method to obtain morphotropic phase boundary in HfxZr1-xO2" Seongho Kim, Sun Koog Moon, Woo Young Park, and Byung Jin Cho, The 29th Korean Conference on Semiconductors, 2022
3

"A Study on the top-tier PMOS fabrication and Performance Improvement of Monolithic 3D Integration Using Green Laser Annealing" Youngkeun Park, Semin Noh, Jaejoong Jeong, Jaecheol Shin, and Byung Jin Cho, The 29th Korean Conference on Semiconductors, 2022
2

"The Process Development for Monolithic 3D Integration Using Large-Scale Silicon-On-Insulator(SOI) Wafer Bonding" Hyeon Cheol Cho, Hoon Hee Han, Jaejoong Jeong, Byung Jin Cho, and Changhwan Choi, The 29th Korean Conference on Semiconductors, 2022
1

"Heterogeneous 3D Sequential CFET with Ge (110) Nanosheet p-FET on Si (100) bulk n-FET by Direct Wafer Bonding" Seong Kwang Kim, Hyeong-Rak Lim, Jaejoong Jeong, Seung Woo Lee, Joon Pyo Kim, Jaeyoung Jeong, Bong Ho Kim, Dae-Myoung Geum, Younghyun Kim, Yongku Baek, Byung Jin Cho, and Sang Hyeon Kim, IEEE International Electron Devices Meeting (IEDM), 2022

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