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1 페이지
2023
8
"Role of Inter-Layer Dielectric on the Electrical and Heat Dissipation Characteristics in the Heterogeneous 3D Sequential CFETs with Ge pFETs on Si nFETs"
S. -K. Kim,
H. -R. Lim, J. Shim, W. Baek, S. Kim, Y. Park, J. Jeong, J. Lim, J. -P. Kim, J. Jeong, B. -H. Kim, D. -M. Geum, B. -J. Cho, S. -H. Kim*,
International Electron Devices Meeting (IEDM),
2023
7
"Wafer-scale growth of amorphous boron nitride thin film"
Hyeongjoon Kim,
Kiryong Kim, Sun-Woo Lee, Min Yung Lee, Gyusoup Lee, YoungKeun Park, Heetae Kim, Yun Hee Lee, Minsu Kim, Kyung Yeol Ma, Min Ju Kim, Taek-Soo Kim, Byung Jin Cho, and Hyeon Suk Shin,
BNW2023 : Inargural workshop on Boron nitride,
2023
6
"Epitaxial Strain Control of HfxZr1-xO2 with Sub-nm IGZO Seed Layer Achieving EOT=0.44 nm for DRAM Cell Capacitor"
Seongho Kim,
Y. K. Park, G. S. Lee, E. J. Shin, W. S. Ko, H. D. Lee, G. W. Lee and B. J. Cho,
2023 Symposium on VLSI Technology and Circuits (2023 VLSI),
2023
5
"NAND Flash Memory 의 메모리 윈도우 확장을 위한 강유전체 스위칭 및 전하 트랩 시 너지 메모리 (Poster Session)"
Eui Joong Shin,
Gyusoup Lee, and Byung Jin Cho,
The 30th Korean Conference on Semiconductors,
2023
4
"Monolithic 3D 집적 공정에서의 ILD 두께에 따른 열 분포 분석"
Jaejoong Jeong,
Youngkeun Park, Yongku Baek, Heetae Kim, Dong Bin Kim, and Byung Jin Cho,
The 30th Korean Conference on Semiconductors,
2023
3
"그린 레이저 다중 조사 열처리 공정 도입을 통한 Monolithic 3D (M3D) 상부 PMOS 소자 특성 향상"
Youngkeun Park,
Jaeoong Jeong, Yongku Baek, Semin Noh, Heetae Kim, Dong Bin Kim, and Byung Jin Cho,
The 30th Korean Conference on Semiconductors,
2023
2
"IGZO Epitaxial Layer를 통한 HfxZr1-xO2 박막의 저온 결정화 유도"
김성호,
고운산, 이가원, 이희덕, 조병진,
The 30th Korean Conference on Semiconductors,
2023
1
"3차원 플래쉬 메모리의 이동도 향상을 위한 산화물 반도체 채널 도입"
Yun Hee Lee,
Tae In Lee , Eui Joong Shin , Seunghyun Oh , Sung Haeng Cho , Chanjong Ju , Jaeduk Lee , and Byung Jin Cho,
The 30th Korean Conference on Semiconductors,
2023
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