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Role of Inter-Layer Dielectric on the Electrical and Heat Dissipation Characteristics in the Heterogeneous 3D Sequential CFETs with Ge pFETs on Si nFETs 
Year
2023 
Author
S. -K. Kim 
Co-author
H. -R. Lim, J. Shim, W. Baek, S. Kim, Y. Park, J. Jeong, J. Lim, J. -P. Kim, J. Jeong, B. -H. Kim, D. -M. Geum, B. -J. Cho, S. -H. Kim* 
Conference
International Electron Devices Meeting (IEDM) 

S. -K. Kim, H. -R. Lim, J. Shim, W. Baek, S. Kim, Y. Park, J. Jeong, J. Lim, J. -P. Kim, J. Jeong, B. -H. Kim, D. -M. Geum, B. -J. Cho, S. -H. Kim, "Role of Inter-Layer Dielectric on the Electrical and Heat Dissipation Characteristics in the Heterogeneous 3D Sequential CFETs with Ge pFETs on Si nFETs", 2023 International Electron Devices Meeting (IEDM), 2023/12, San Francisco, CA, USA, accepted