System-Level Thermal Management and Capacitor Reliability Enhancement in Heterogeneous 3D Integrated Power Delivery System 

Year

2026 

Author

Minhyeok Lee, Chan Jik Lee 

Co-author

Bong Ho Kim, Donggeon Lee, Jongun Beom, Sunghwan Lee, Chae Yeon Han, Heetae Kim, Younkeun Park, Byung Jin Cho, Jaeyong Jeong, Sanghyeon Kim 

Conference

2026 International Electron Devices Meeting (IEDM)