Copper Interconnect Device Including Surface Functionalized Graphene Capping Layer and Fabrication Method Thereof
- Inventor
- B. J. Cho, S. J. Yoon, H. A. Yoon
- No.
- 10-1633039
- 출원국가
- 국내
- Date
- 2016
Copper Interconnect Device Including Surface Functionalized Graphene Capping Layer and Fabrication Method Thereof